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62^nd ECTC Call for Papers and Professional Development Course Proposals
The premier international packaging, components and microelectronic systems technology conference

You are invited to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

Advanced Packaging
Applied Reliability
Assembly and Manufacturing Technology
Electronic Components & RF
Emerging Technologies
Interconnections
Materials & Processing
Modeling & Simulation
Optoelectronics
Interactive Presentations (formerly Posters)

Submission Guidelines
The content must be original, previously unpublished, non-confidential and without commercial content.

All abstracts and proposals must be submitted electronically at www.ectc.net by October 10, 2011. Selected authors and instructors will be announced December 15, 2011.

Abstracts
All accepted papers will be presented during oral, interactive presentations or special student poster sessions. Abstracts must have 250-750 words.
For more information, contact: Senol Pekin, 62^nd ECTC Program Chair
Intel Corporation, USA Phone: +1-480-552-4898
Email: spekin@msn.com
Professional Development Course Proposals
Selected instructors will teach four-hour education courses. To be considered, please include your course objective, outline and a description of who should attend as part of your 200-word proposal.

For more information, contact: Kitty Pearsall, 62^nd ECTC Professional Development Course Chair IBM Corporation, USA Phone: +1-512-286-7957
E-mail: kittyp@us.ibm.com